Flexible Electronics – Packaging Design and Materials Analysis – Spring 2016
15 Middlesex Canal Park Dr
Woburn, MA 01801
USA
For Aerospace, Military, Medical & High end Consumer Products
Speaker:/Instructor: Tina Barcley, Chief Technical Officer TAS Consulting
Decision (Run/Cancel) Date for this Course is March 16, 2016
Payment received by 14 March
IEEE Members $235
Non-members $260
Payment received after 14 March
IEEE Members $260
Non-members $285
Phone 781-245-5405
email sec.boston@ieee.org
Fax 781-245-5406
Make Checks payable to:
IEEE Boston Section
One Centre Street, Suite 203
Wakefield, MA 01880
Class Summary: This is a one-day session focusing on the advanced packaging needed for a flexible board design. This course will not cover schematic layout and circuit design. It will cover what you do with the completed schematic. It will address layout issues to avoid and what components work best in a flexible design. It will show what methods are available and almost available to package the flexible circuit board. What materials work best for which industry? What analysis should be performed to assure the design will work in the intended environment?
Prerequisites: Assume Student can read schematics, understand component usages and has some basic thermal analysis capability.
Who should attend? This course is designed for Engineers involved in the above design elements of a project. This course will demonstrate the work needed to review the materials and environment for designs using flexible circuits.
Course Objectives:
• Understand circuit board layout changes for flexible electronics
• Show how to remove Heat in a flexible board.
• Review, Show, Typical Analysis needed for Reliability concerns
• Review electronics Packaging Issues and How to handle them
• Introduce Solder Fatigue concepts and what to do about it
• Review different Industry needs and show the key indicators for each.
Course Schedule:
1. Review student backgrounds and industries – course will be pushed toward the industries represented. (1/2 hr.)
2. Basic background on flexible boards (1/2 hr.)
3. Review schematic layouts – what works and what doesn’t – this will be industry specific. (1/2 hr.)
4. Review analysis needed: structural, thermal, reliability, solder fatigue (1 hr.)
5. Walk through analysis for each of the above. (1 hr.)
6. Show issues of each of the analysis types, work-arounds, show stoppers, and realistic answers to some industry concerns. (1 ½ hr.)
7. Review solder fatigue differences for different solders. (1/2 hr.)
8. Review any additional industry needs specific to student’s industries and questions. (1 hr.)
9. Lab Time- Students to work on project – can bring one or work on one provided. (1 ½ hr.)
Tina Barcley has over 30 years of experience in electronic packaging, testing, and analysis (BS Engineering – Thermal and Materials and MS – Systems Engineering and program management. Tina worked for aerospace companies (ITT, TRW, Perkin Elmer, Goodrich and Aerojet), NASA (Marshall Space Flight Center), automotive (both Ford and Chrysler), military black boxes (Singer Librascope, Army, Navy and Air Force modules) as well as high end medical and commercial (Spectracom, MKS, Kodak, etc.). She has run and created testing labs, procedures, designs, fixes for designs, and the first BGA used in high temperature environments.
Tina has R&D experience, proposal experiences, and program management experience in all the above industries. She has 21 US patents — all in electronics packaging, materials, and thermal. . Her experience has included all levels of parts reliability for systems ranging from 6-month to 10-year reliabilities. She is a frequent speaker at industry-specific conferences like IMAPS (International Microelectronics and Packaging Society) and ASE (Automotive Society of Engineers) and is on the IPC (IPC – Association Connecting Electronics Industries) Specification Review Panel.