Creating Reliable and Manufacturable RF Designs

September 13, 2017 @ 5:30 pm – 8:00 pm America/New York Timezone
MIT Lincoln Laboratory
3 Forbes Rd
Lexington, MA 02421

Reliability Society

Chandra Gupta, Ph.D., MBA

Electronic system demands for smaller size, lighter weight, lower power consumption and lower cost (also known as SWAP-C) are being met through design, development and production of heterogeneous high density packages, system in package (SIP), and system on chip (SOC). Complex monolithic chips containing high number of semiconductor devices present unique challenges when it comes to determining reliability.

Reliability is designed in by taking numerous device physics properties into account. Many of the effects such as activation energy, electro migration, hot carrier injection, dissimilar metals and whisker growth need to be taken in consideration when designing RF systems and for that matter any other electronic systems. The production considerations incorporate overall the best value, manufacturability, quality, parts obsolescence, supply chain and support through the life of the systems. These issues will be covered and show that implementing these measures leads to overall value, higher reliability and a lower total cost ownership.

Chandra Gupta, Ph.D., MBA of Communications and Power Industries (CPI)


Dr. Chandra Gupta, Ph.D.(EE) and MBA has over thirty years of experience in RF and microwave industry. He has designed, developed, managed and produced a wide range of RF, microwave and millimeter wave components, integrated microwave assemblies and custom assemblies with cutting edge technologies for commercial and defense applications.

He has held positions raging from IPT Manager at BAE Systems, VP of Operations and Engineering at Herley Industries, General Manager at Aeroflex and Director at Hittite . He is now a Senior Engineering Program Manager at Communications & Power Industries (CPI) at Beverly, MA developing and producing High Power Amplifiers.

Dr. Gupta is a Senior Member of Institute of Electrical and Electronics Engineers.



This meeting will be held on Wednesday, September 13, 2017 at 3 Forbes Road, Lexington, MA.
5:30-6:00 PM: Sign in, refreshments, and personal networking
6:00-6:10 PM: Chapter Chair greetings and announcements
6:10-7:45 PM: Presentation, Chandra Gupta, Communications and Power Industries (CPI)
7:45-7:55 PM: Q&A session, meeting adjourns

Meeting Location: MIT Lincoln Laboratory, 3 Forbes Rd, Lexington, Massachusetts