“2D & 3D Printing; Changing Form Factors in Microwave Electronics”

December 11, 2019 @ 5:30 pm – 7:30 pm America/New York Timezone
MIT Lincoln Laboratory
3 Forbes Road
MA 02421

Reliability Society

Dr. Craig Armiento

Applications such as the Internet of Things (IoT), flexible radars and 5G telecommunications will require new electronic form factors in the microwave and millimeter frequency domains. These applications may require electronics that are flexible, conformable, wearable or embedded in 3D objects. Printed electronics (PE) is an additive manufacturing (AM) approach that prints electronic materials to fabricate subsystems directly from CAD files. PE is not a replacement for active components, rather, printed subsystems will use best of breed semiconductors and exploit additive technology to print IC interconnects, passive components, antennas or connectors. This approach can be described as additive microelectronic/microwave packaging. This talk will describe research in printed microwave electronics at the University of Massachusetts Lowell in collaboration with corporate partners such as Raytheon through the RURI and PERC organizations. Research activities include the development of materials and processes that enable printing of 2D and 3D antenna arrays, phased arrays and frequency selective surfaces (FSS). New material formulations and processing are key to development of additive microwave technology. An example is a unique ferroelectric ink that was developed at UML with a tunable permittivity. This ink has been used to print varactors, phase shifters and tunable FSS.

Craig Armiento is a Professor in the Electrical and Computer Engineering (ECE) Department at the University of Massachusetts Lowell. He is a founder and Co-Director of the Raytheon-UMass Lowell Research Institute (RURI) and is the Director of the Printed Electronics Research Collaborative (PERC). Prof. Armiento served as Chair of the Electrical and Computer Engineering Department from 2005-2011. Prior to coming to UMass Lowell in 2003, Prof. Armiento had over twenty years of industrial R&D experience leading research teams at GTE Laboratories (now Verizon) on projects including Fiber-to-the-Home (now FiOS), optoelectronic hybrid integration, photonic device fabrication and packaging and GaAs ICs. He also served as Director of Optical Networking at Lightchip Optical Networks Inc. and was a researcher at MIT Lincoln laboratory. Prof. Armiento has over 100 publications and presentations and 18 U.S. patents. He earned his Ph.D. and two masters degrees from MIT and a BSEE from Manhattan College.

MEETING LOCATION: MIT Lincoln Laboratory, 3 Forbes Rd, Lexington, MA, 02421

Registration: click here

Directions to 3 Forbes Road, Lexington, MA:

• Take Route 128/I-95 to Exit 30B, Route 2A Westbound.
• At the first traffic light, turn left onto Forbes Road.
• Go to the end of the street.
• At the traffic circle, turn right.
• Go halfway around the traffic circle and turn into the parking lot for MIT Lincoln Laboratory
• The main entrance is straight ahead, shared with “agenus”.