This tutorial is available on demand starting May 29, 2024
You will have 180 days to access this on-line course.
Course Fee Schedule: Registration is On-Going
Cost: $70.00
Refund Policy: No refunds for online courses once the course is accessed by the attendee.
Whether in the defense, healthcare, consumer electronics, or communication industries, having a fundamental knowledge of electronic packaging reliability is now crucial in order to develop safe and durable products. In this webinar, the common overstress and wearout failure mechanisms found in electronics will be presented. The failure mechanisms to be discussed include fracture, fatigue, wear, time independent dielectric breakdown, dendrite growth, and more. The discussion of each mechanism will include a description of the failure, the common life models used to predict the failure, and methods to mitigate the failure. The presentation will conclude with a brief look into the next generation of electronics packages and the expected reliability concerns as packages become more advanced.
This presentation is part of a two-lecture mini-series covering electronics reliability failure mechanisms and validation testing. This lecture focusses on developing a fundamental background of electronics failures. The subsequent lecture will focus on developing validation tests based on the fundamental failure mechanisms presented here.
TAKEAWAYS:
- An understanding of the fundamental mechanical and electrical reliability concerns of electronics packages; once an understanding is developed, the mitigation techniques can be more easily conceived.
- A list of the common failure mechanisms in electronics packages and the common life stress models used to describe them.
- A glimpse into the future of electronic packaging and the reliability challenges that are predicted to arise.
Bio: Dr. Nathan Blattau
Dr. Nathan Blattau, Distinguished Engineer at Ansys, has been involved in the simulation and reliability of electronic equipment for over twenty years. Prior to joining Ansys, Dr. Blattau was the Vice President and Chief Scientist of DfR Solutions. He holds two patents and has authored over 20 papers and has presented on a wide variety of reliability issues within the electronics industry. His specialties include best practices in design for reliability, robustness of Pb-free, failure analysis, accelerated test plan development, nonlinear finite element analysis, and solder joint reliability. Dr. Blattau holds a Ph.D. in Mechanical Engineering, an M.S. in Mechanical Engineering, and a B.S. in Civil Engineering from the University of Maryland.
We can offer Continuing Education Units (CEU) and Professional Development Hours (PDH), if requested. A small fee may apply for the credits.