Generative AI has been driving demand for high performance GPU based servers and increased loads at data centers. Chip makers have in turn been focused on development of MPUs and GPUs optimized for AI. 5 and 6G applications likewise require sensing, computation and transfer of large volumes of data without latency. All these applications have been pushing electronics towards heterogenous integration with 2.5 and 3D chiplets which allow for greater speeds, functionality and smaller footprints. However, these newer designs, materials and shrinking of scale cause thermal management and reliability issues in electronics introducing new failure sites and modes.

This webinar will focus on the critical role reliability plays in the design, manufacturing, and long- term performance of electronic systems. The presentation will start with an overview of the semiconductor supply chain, answering questions such as “who are the key players in various industries?”; and “what is driving innovation and how is it taking shape?”; The session will continue with addressing key foundational electronics reliability concepts such as the bathtub curve, the difference between reliability physics and handbook calculations, prognostic health management, and common failure mechanisms. Additional time will be spent describing the reliability challenges presented by advanced packaging, like 3D heterogeneous integrated packages.

Live Speaker: Dr. Jonathan Kordell at MIT Lincoln labs

Dr. Jon Kordell, Ph.D is a Lead Reliability Consulting Engineer at Ansys with almost a decade of experience in electronic packaging reliability, accelerated testing and failure analysis. His current role is focused on the reliability of electronic devices in a range of environments via a combination of physical characterization and analytical modeling including finite element analysis. Jonathan received his PhD in mechanical engineering from the University of Maryland at the Center for Advanced Life Cycle Engineering (CALCE)

Incidentals:

• Price: $70

• Duration: 2 hours

Abstract:   Whether in the defense, healthcare, consumer electronics, or communication industries, having a fundamental knowledge of electronic packaging reliability is now crucial in order to develop safe and durable products. In this webinar, the common overstress and wearout failure mechanisms found in electronics will be presented. The failure mechanisms to be discussed include fracture, fatigue, wear, time independent dielectric breakdown, dendrite growth, and more. The discussion of each mechanism will include a description of the failure, the common life models used to predict the failure, and methods to mitigate the failure. The presentation will conclude with a brief look into the next generation of electronics packages and the expected reliability concerns as packages become more advanced.

TAKEAWAYS:

1) An understanding of the fundamental mechanical and electrical reliability concerns of electronics packages; once an understanding is developed, the mitigation techniques can be more easily conceived.

2) A list of the common failure mechanisms in electronics packages and the common life stress models used to describe them.

3) A glimpse into the future of electronic packaging and the reliability challenges that are predicted to arise.