Electronic Compatibility Society

Join Us for a Special Evening with Two Expert Speakers, 10m EMC Chamber Tour, and Hosted Dinner! IEEE IMS 2026 Attendees are Welcome!

Hosted at:  TÜV Rheinland North America, Technology and Innovation Center

Co-Sponsored by: Amber Precision Instruments, ETS-Lindgren, and Rohde & Schwarz.

The unique technical program features active technical contributors to the ANSC C63 committee and industry leaders. Our speakers are in Boston attending the IEEE International Microwave Symposium (IMS) 2026 the week of June 8. We appreciate their willingness to present at our chapter meeting while they are in town. There is no charge to attend, but you must register in advance. IEEE members and non-members are welcome!

Dinner is provided courtesy of co-sponsors Amber Precision Instruments, ETS-Lindgren, and Rohde & Schwarz.

AGENDA:

5:30 pm: Registration check-in, complimentary dinner, and refreshments

6:20 pm: Welcome from TÜV Rheinland North America and IEEE Boston EMC Chapter

6:25 pm: “EMC Scan Technologies” by Jin Min, Amber Precision Instruments

7:10 pm: “EMC Chamber Modeling and Design Optimization” by Yibo Wang, ETS-Lindgren

7:50 pm: Overview of Facility Tour Including Review of R&D in 10m Chamber by ANSC C63 by Bob Mitchell, TÜV Rheinland

8:05 pm: Facility Tour of TÜV Rheinland

9:00 pm: Adjourn

See presentation abstracts and speaker bios below.

Location: TÜV Rheinland North America, Technology and Innovation Center,

400 Beaver Brook Road, Boxborough, MA

Parking: Complimentary parking is available

Register: All IEEE members and guests are welcome to attend. There is NO CHARGE to attend, but you must register in advance:

vTools event page: IEEE Boston EMC Chapter Meeting and Technical Tour: TÜV Rheinland North America’s Northeast Technology & Innovation Center: vTools Events | vTools IEEE

Link to registration: https://www.eventbrite.com/e/ieee-boston-emc-chapter-meeting-tickets-1989786166989?aff=oddtdtcreator&keep_tld=true

Please register no later than Tuesday June 9th in order to ensure adequate seating and catering.

TECHNICAL PRESENTATIONS

EMC Scan Technologies

Near field scanning is a widely known and well received method for component, module and system EMC characterization. One specific emission scan technology, called the NF EMI scan, is the most common scan technology, but the immunity scan is relatively less known and less widely used. Three immunity and two emission scan technologies will be presented: ESD Scan, RF Immunity Scan, Current Spreading (CSP) and Phase Measurement Scan. ESD scan is a very effective technique to debug or pre-screen components or modules that are more likely to cause problems (especially soft failures) before they are integrated to a system. Its main goal is localizing weak spots or traces causing ESD gun test failures with a well-controlled disturbance source. RF Immunity Scan is very similar to ESD scan in concept, but it is a narrow-band scan while the ESD scan is a wide-band. Most currents injected by an ESD gun follow the intended path by design, but a small amount causing system upset can flow through an unexpected route. CSP (Current Spreading) is a visualization technique for surface current flows, which identifies unexpected current paths and can verify ESD protection design. Phase information helps improve accuracies of modeling of EUT’s for simulation or can be directly used for specific applications. Specific application of the phase information will be introduced after a brief review.

EMC Chamber Modeling and Design Optimization

EMC chamber performance is validated using standardized tests such as Normalized Site Attenuation (NSA), Site Voltage Standing Wave Ratio (sVSWR), and Field Uniformity (FU), as defined in ANSI, CISPR, and IEC standards. Meeting requirements such as +/ – 4 dB NSA and 6 dB sVSWR can be straightforward when space and budget are not limiting factors. In real projects, however, chamber design usually involves many practical tradeoffs, including building size, budget, quiet zone requirements, absorber selection, and absorber coverage. Because of these constraints, it is important to understand the expected chamber performance early in the design process. Simulation provides a practical way to compare design options, identify potential performance issues, and optimize the chamber layout before construction. Accurate chamber modeling can help guide key decisions such as chamber size, geometry, absorber type, absorber placement, and test setup. Design optimization often requires running many simulation cases, so simulation speed is also an important factor. Full-wave solvers can provide accurate results, but a single chamber configuration may take several days to complete. Ray-tracing methods are commonly used in industry because they are computationally efficient, but they are not accurate below 100 MHz, which is the most critical frequency range for chamber design. To address this limitation, this presentation introduces a hybrid chamber simulation method based on the Discrete Complex Image Method (DCIM) and Geometrical Optics (GO) ray tracing. This hybrid approach improves low-frequency accuracy while retaining the efficiency of the GO method. The presentation will also provide an overview of a simulation-driven EMC chamber design workflow and show how simulation can support practical design decisions. Several newly built EMC chambers and chamber relining projects will be presented as case studies. Simulated results will be compared with measured chamber validation data to demonstrate the accuracy of the modeling approach. One case study will show how the simulation tool was used to significantly improve chamber performance and help a previously failed chamber meet validation requirements after relining.

About the Speakers:

Kyungjin “Jin” Min was born in Korea and immigrated to USA in 1982. He earned his Ph.D. in electrical engineering from North Carolina State University in 1998. After working at LSI Logic and Perkin-Elmer for a few years, he co-founded Amber Precision Instruments (API) in 2006, which develops EMC scan technologies and manufactures EMC scanners in 2006. He is currently the president of API which is headquartered in San Jose, California, USA.

Yibo Wang received his Ph.D. in electromagnetics from the University of Houston, an M.S. in electrical and computer engineering from The Ohio State University, and a B.S. from Wuhan University. He is currently a Principal RF Engineer with ETS-Lindgren in Cedar Park, Texas. His work focuses on chamber design and modeling, absorber modeling, and RF testing. His research interests include antenna measurement techniques, echo-reduction techniques for test environments, EMC measurements, and dielectric measurement techniques. He serves on the IEEE EMC Society Technical Program Committee and Antenna Measurement Techniques Association (AMTA) Technical Coordinating Committee. He is also a working group member of the IEEE 1128 (absorber evaluation) and IEEE 1309 (probe calibration) standards working groups. Dr. Wang co-authored papers that received Best Paper Awards at AMTA 2022 and 2023.

Bob Mitchell is the Director of Laboratory Technology and Innovation at TÜV Rheinland, based in Boxborough, MA. Bob also holds the role of EMC technical manager for TÜV Rheinland of North America. Along with the roles and tasks Bob does for TÜV Rheinland, Bob is one of the USNC member experts for the ISO, CISPR D, SAE, ANSC C63®, and 5GAA committees. Bob is also an active member of the Advisory Committee for Electromagnetic Compatibility for the IEC representing TC125, TC47 and the US National Committee. Over the course of his career, Bob has presented many workshops at the IEEE EMC+SIPI Symposiums, authored technical papers, and has supported technical data for development of many new EMC standards across the organizations. In the role of Director of Laboratory Technology and Innovation for TÜV Rheinland North America, Bob has the responsibility for developing and expanding test capabilities, opportunities, and test facilities in the various markets for TÜV Rheinland. He may be reached at rmitchell@us.tuv.com.

In case of questions regarding location, please contact:

Robert Mitchell, Director, Lab Technology & Innovation, TÜV Rheinland rmitchell@us.tuv.com