RF radiated emissions from Electric Vehicles – Regulatory Challenges

Electromagnetic Compatibility Society

 Keith Frazier, Ford Motor Company

Hosted at:  TÜV Rheinland North America, Technology and Innovation Center

Sponsored by Silent Solutions, LLC http://www.silent-solutions.com/

The technical presentation will commence at 7:00PM following a social hour at 6:00 PM. Food and refreshments are provided.

6:00 pm:  Registration/check-in, complimentary food and refreshments

6:50 pm:  Welcome from TÜV Rheinland North America and IEEE EMC Boston Chapter

7:00 pm:  Presentation by Keith Frazier, Ford Motor Company (abstract and bio below)

7:45 pm:  Q&A

8:00 pm:  Optional tour of the new TUV facility

Parking:  Complimentary parking is available

Register:  Click here to register online: https://events.vtools.ieee.org/event/register/417496

Please register no later than May 15 in order to ensure adequate seating & catering.

Thank you to our meeting host TUV and sponsor – Silent Solutions!

Technical Presentation

RF radiated emissions from Electric Vehicles – Regulatory challenges.

By Keith Frazier, Senior Technical Leader of Electromagnetic Compatibility, Ford Motor Company

Abstract: Unlike internal combustion engines, electric powertrain in automotive applications pose much greater challenges in meeting regulatory requirements with respect to far field radiated RF emissions.  This talk will review the basic physical mechanisms of the EV powertrain that contribute toward RF emissions from the vehicle.  Various mitigation techniques are summarized along with the engineering tradeoffs they create.  Current and future regulatory requirements are also reviewed.

 About the Speaker

Keith Frazier, Senior Technical Leader of Electromagnetic Compatibility, Ford Motor Company, is responsible for oversite of all EMC design of Ford automotive products worldwide. His interests include system/subsystem design and analysis for EMC. Between receiving his BSEE from Purdue University in 1976 and joining Ford in 1990, Keith served as an EMC and TEMPEST design engineer for various automotive and aerospace firms including GM, Lockheed and Magnavox Government Electronics.

He is a Life Senior member of IEEE and has authored and presented over 12 technical papers and presentations at regional and international symposia.  Keith has authored and co-authored multiple SAE and ISO immunity standards as an active member of the USTAG to CISPR D and ISO international standards committees.

In 2008, Keith served as Technical Papers Co-chair for the 2008 IEEE EMC Symposium held in Detroit Michigan.  In the fall of 2023, he was elected as member at large of the EMC Society’s Board of Governors.

Directions:

TUV Rheinland Technology and Innovation Center; 400 Beaver Brook Road, Boxborough, MA 01719

https://maps.app.goo.gl/JskKZrYbDBkQRDpeA

In case of questions regarding location, please contact:

Robert Mitchell
EMC & Envir. Servs Segment Mgr-America
rmitchell@us.tuv.com