HYBRID – TOM MEUSE: ESD DEVICE LEVEL TESTING STANDARDS REVIEW, AND DIE TO DIE AND DIRECT PIN INJECTION TESTING IMPACTS

IEEE Boston/Providence/New Hampshire Reliability Chapter 

As device technologies evolve and continue to shrink, manufacturing methods are also being stressed, which can impact yields due to ESD performance. ESD test standards are continuing to evolve as well to meet these changes. However as complex devices such as 3D packing with 1000s of Die to Die interconnects become more widely used, this is challenging the “standard” way ESD testing is performed.

Another point of interest for system level testing, is call for a Direct Pin Injection test method. Although the most widely used system level testing standard, IEC 61000-4-2 standard recommends not performing testing on pins of a connector, many manufacturers are being forced to perform this test. We’ll discuss the Industry Councils on ESD Target Levels approaches to this testing requirement.

Tom Meuse of Thermo Fisher Scientific

As device technologies evolve and continue to shrink, manufacturing methods are also being stressed, which can impact yields due to ESD performance. ESD test standards are continuing to evolve as well to meet these changes. However as complex devices such as 3D packing with 1000s of Die to Die interconnects become more widely used, this is challenging the “standard” way ESD testing is performed.

Another point of interest for system level testing, is call for a Direct Pin Injection test method. Although the most widely used system level testing standard, IEC 61000-4-2 standard recommends not performing testing on pins of a connector, many manufacturers are being forced to perform this test. We’ll discuss the Industry Councils on ESD Target Levels approaches to this testing requirement.

Tom Meuse is an Applications/Product/Technology Engineer for the Compliance Test Solutions division of Thermo Fisher Scientific, which is located in Tewksbury MA, USA. He is responsible for the Thermo Scientific ESD and Latch-up test system operations and future product research. Tom is a member of the ESD Association Device Testing (WG-5.x) committee, chair of the ESDA’s WG14 System Level working group and a member of the JEDEC JC-14.1 Committee on Reliability Test Methods. He’s also a member of the Joint ESDA/JEDEC Device Testing work group and a contributing member to the Industry Council on ESD Target Levels. In addition, he’s also a Board of Directors member on both the National and the Northeast Chapter of the ESD Association.

During Tom’s 40 plus year career, which began with KeyTek Instruments, he worked on Surge and ESD simulator designs, in both an engineering capacity and as the project manager on both system level and device level testers. He’s provided numerous technical seminars focusing on ESD/Latch-up testing and Standards Evolution and has authored and co-authored numerous papers on topics relating to ESD device level testing and ESD system design.

Agenda

5:30 PM     Pizza, salad, soda, and Networking

6:00  PM   Technical Presentation

6:45 PM    Questions and Answers

7:00 PM    Adjournment

The meeting is open to all.  You do not need to belong to the IEEE to attend this event; however, we welcome your consideration of IEEE membership as a career enhancing technical affiliation.

There is no cost to register or attend, but registration is required.

Registration:  https://events.vtools.ieee.org/m/427623