The professional home for the engineering and technology community worldwide.

Calendar of Events

Sun Mon Tue Wed Thu Fri Sat
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI and Advanced Packaging 5:00 pm
Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI and Advanced Packaging @ MIT Lincoln Laboratory
Sep 17 @ 5:00 pm – 8:00 pm
Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI and Advanced Packaging @ MIT Lincoln Laboratory
Reliability Chapter Ahmed A. Busnaina, William Lincoln Smith Professor, University Distinguished Professor and Director, NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing Northeastern University, Boston, MA 02115, Register here:   We introduce a new sustainable and scalable technique to manufacture nano and microelectronics additively. The technique eliminates etching, vacuum deposition, …
18
19
20
21
22
23
24
25
26
27
28
29
30