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Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI and Advanced Packaging
5:00 pm
Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI and Advanced Packaging
@ MIT Lincoln Laboratory
Sep 17 @ 5:00 pm – 8:00 pm
![]() Reliability Chapter Ahmed A. Busnaina, William Lincoln Smith Professor, University Distinguished Professor and Director, NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing Northeastern University, Boston, MA 02115, Register here: We introduce a new sustainable and scalable technique to manufacture nano and microelectronics additively. The technique eliminates etching, vacuum deposition, …
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