The Impact on EMC, SI, and PI When Using Ultra-Thin Laminates in PCBs

Electromagnetic Compatibility Chapter

The IEEE EMC Boston Chapter is Pleased to Announce a Meeting / Technical Presentation with Speakers from Oak-Mitsui Technologies:

Hosted at: Intertek, Boxborough, MA

Co-sponsored by:  Intertek

Agenda:

5:00 pm Registration/check-in, complimentary dinner and refreshments

6:00 pm Welcome from Intertek and IEEE EMC-S Boston Chapter

6:10 pm Lab Tour

6:30 pm “The Impact on EMC, SI, and PI When Using Ultra-Thin Laminates in PCBs” by Bob

Bob Carter and John Ranieri, Oak-Mitsui Technologies

7:15 pm Q&A – Closing Comments

7:30 pm Adjourn

See presentation abstract and speaker bios below.

Location: Intertek USA, 70 Codman Hill Rd, Boxborough, MA 01719

Parking:  Complimentary parking is available

Register: There is NO CHARGE to attend, but please register in advance. All IEEE members and guests are welcome to attend.

Click here to register

Please register no later than June 18 to ensure adequate seating and catering.

TECHNICAL PRESENTATION

Presenters: Bob Carter and John Ranieri, Oak-Mitsui Technologies

The increase in data rates and processing speeds driven by AI and next generation device complexity, require more precise filtering, improved signals, and power with less noise. This discussion will focus on the newest studies showing how using some ultra-thin and high Dk laminates in PCB’s will improve the EMC, SI and PI. It also shows benefits to space utilization, and stack-up thicknesses.

Bob Carter – Oak-Mitsui Technologies

Bob is Vice President of Marketing, Business Development, and Technology for Oak-Mitsui’s FaradFlex ultra-thin embedded capacitance materials and support of advanced technology VSP and Micro-Thin copper. He has over 35 years of professional experience in printed circuits, advanced electronic materials, MEM’s, RF modules, sensors, and chip packaging at companies such as Xerox, M-Flex, Rogers Corporation, and Panasonic Electronic Materials. He studied Chemical & Materials Engineering and Business Management at California Polytechnic University, Pomona, California and Grand Canyon University, Phoenix, Arizona.

John Ranieri, Oak-Mitsui Technologies

John Ranieri is the OEM Marketing Director for Oak-Mitsui Technology’s FaradFlexTM laminates – thin dielectrics for printed circuit board embedded capacitance. John has over 20 years’ experience in PCB materials at Oak-Mitsui and Rogers Corporation and has worked with OEM customers designing a wide range of high frequency and high-speed PCBs. John’s holds a B.S. in Chemical Engineering from Case Western Reserve University and an MBA from ASU’s W.P. Carey School of Business.