BGA Reliability and Manufacturing Challenges

IEEE Boston/Providence/New Hampshire Reliability Chapter

Please visit www.ieee.org/bostonrel

FREE Webinar

The reliability and manufacturability of BGA devices is becoming more dependent on the PCB structure, layout and chassis design. With every increasing part densities the chassis design (PCB mounting), board layout, and underfills can cause additional stresses to be applied to the BGA device beyond just the thermal expansion mismatch. This presentation will cover some of the thermal-mechanical issues, manufacturing defects, and modeling techniques that can be used to help determine the reliability of BGA devices.

Location: This Webinar is to be delivered virtually.

At registration, you must provide a valid e-mail address to receive the Webinar Session link approximately 15 hours before the event. The link will only be sent to the e-mail address entered with your registration. Please double-check for spelling errors. If you haven’t received the e-mail as scheduled, please check your spam folder and alternate e- mail accounts before contacting the host.

Hosts Boston/Providence/New Hampshire Jt Sections,RL07

Michael W. Bannan, Chair

IEEE Boston/Providence/New Hampshire Reliability Chapter

Registration Starts 16 January 2023 12:00 AM Ends 07 February 2023 05:30 PM

All times are (GMT-05:00) US/Eastern No Admission Charge

Speaker:  Nathan Blattau of Ansys

Topic: BGA Reliability and Manufacturing Challenges

Agenda:

11:00 AM – Technical Presentation

11:45 AM – Questions and Answers

12:00 PM – Adjournment

The meeting is open to all. You do not need to belong to the IEEE to attend this event; however, we welcome your consideration of IEEE membership as a career enhancing technical affiliation.

There is no cost to register or attend, but registration is required.