Spring 2019 – This course has been canceled!
Dates: Monday, April 8 and Tuesday, April 9, 2019
Time: 9:00AM – 4:30PM
Decision date: Monday, April 1, 2019
Early Registration Date deadline: Monday, March 25, 2019
Before Early Registration Date
IEEE Members: $415
After Early Registration Date
IEEE Members: $445
WHERE: Crowne Plaza Hotel, 15 Middlesex Canal Park Road, Woburn, MA
If paying by check, the check must be received before the appropriate dates for Early Registration and Decision Dates.
Make Checks payable and send to:
IEEE Boston Section
One Centre Street, Suite 203
Wakefield, MA 01880
Overview: One of the most demanding consumer products in the market is the wireless telecommunication product. A well-designed Radio Frequency Printed Circuit Board (RF PCB) contributes significantly to the success of any wireless product as the layout of the PCB greatly affects the performance, stability and reliability of the product. In today’s highly competitive wireless products market with increasingly compressed development time-frame, there is a strong demand for RF professionals who possess the knowledge and experience to design top-performing RF PCBs in less number of iterations. What matters is whether your level of competence is up to the required standard to meet such demand.
Audience: RF Designers, Wireless Product Designers, Field Application Engineers, Design Managers and related professionals.
Benefits: This course aims to provide participants with an insightful training on RF PCB design from a practical, industrial perspective. Participants will be led through a systematic, theoretical presentation with case studies on commercial products in the training. The course will be conducted by an RF expert with rich industrial experience. It is suitable for RF professionals who want to keep up-to-date their skills and knowledge in RF PCB design and stay competitive.
1. Printed circuit board design for RF circuits
From product design, circuit design to PCB design
Layer stack-up assignment
Grounding methods and techniques
Interconnects and I/O
Bypassing and decoupling
2. Printed circuits board design for other circuits
3. PCB design for EMC/EMI compliance
4. Additional Design Techniques
Systematic product design approach
Other RF concerns
5. Case studies
Expertise: Henry Lau received his M.Sc. and MBA degrees from UK and USA respectively. He has more than 25 years of experience in designing RF systems, products and RFICs in both Hong Kong and US. He worked for Motorola and Conexant in US as Principal Engineer on developing RFICs for cellular phone and silicon tuner applications. Mr Lau holds five patents all in RF designs. He is currently running Lexiwave Technology, a fables semiconductor company in Hong Kong and US designing and selling RFICs, RF modules and RF solutions. He has also been teaching numerous RF-related courses internationally.