Thin PCB Dielectric Technology

When:
June 21, 2017 @ 6:00 pm – 8:00 pm America/Toronto Timezone
2017-06-21T18:00:00-04:00
2017-06-21T20:00:00-04:00
Where:
Bose Corporation
100 The Mountain Rd
Framingham, MA 01701
USA

Electromagnetic Compatibility Society

Bob Carter, Oak-Mitsui Vice President of Marketing

Device data rates have increased tremendously since the late 2000¹s and years since smart phone technology and other high speed devices hit the market. This change forced internet infrastructure, computing and technology companies that processed data to make changes. They were pushed to design and develop next generation chips, PCB¹s, and other architecture to meet the challenge of the new higher speed, higher volume systems. These changes and requirements have led to increasing processing speeds, lower power delivery margins, and new design sets and expanded into almost all areas of technology. When older more traditional PCB¹s design guidelines are used to design PCB¹s for systems that operated beyond 200 MHz there are significant resonances that occur. These are resonances starting within the PCB and that may resonate to the whole system as noise, signal loss and distortion, and EMI. One proven way to significantly reduce resonance is to narrow the gap between the power-ground plans within the PCB. This presentation will show the benefits of using thinner dielectrics in PCB¹s,modules and packages between the power and ground planes. It will show that thinner is significantly better at reducing noise and resonances especially at frequencies beyond 200 Mhz and up to 25 Ghz. Additionally it will look at the effect of effects of higher high Dk versus standard Dk, and high Df versus low Df.

Biography: Bob Carter is Vice President of Marketing, Business Development, and Technology for Oak-Mitsui’s FaradFlex ultra-thin embedded capacitance materials and advanced technology VSP copper. Bob has over 32 years of professional experience in the printed circuits, advanced electronic materials, MEM’s, RF modules, and chip packaging. Directs engineering, marketing, and sales worldwide. He initiated the start-up of 2 major PCB factories in China. Led engineering, development, and applications organizations at companies such as Xerox, Toppan, Multi-Fineline Electronix, Rogers Corporation, Flex2Chip Inc, and Panasonic Electronic Materials. Bob studied Chemical & Materials Engineering and Business Management at California Polytechnic University, Pomona, California and Grand Canyon University, Phoenix, Arizona and has a BS Degree.

Meeting Details: The meeting of the EMC Society will be held on Wednesday, June 21, 2017 at Bose Corp., 100 The Mountain Road, Framingham, MA. The technical presentation will commence at 7:00PM following a social hour at 6:00 PM. Food is provided.

DIRECTIONS TO BOSE CORPORATE HEADQUARTERS: The address is: 100 The Mountain Road, Framingham, MA, 01701 From Mass Pike (I-90); Take Exit 12 (Route 9 West) toward Worcester. Keep left at the fork on the ramp and get on Route 9 West. At the first set of lights take a right onto California Ave. (sign reads “Framingham Technology Park”). Go straight, over the railroad tracks, and through the next set of lights. The road curves around to a stop sign at the foot of the mountain. Take a left onto the Mountain Road and follow it to the next stop sign at the top of the mountain. The tall glass building before you is the Bose Corporate Center. Take a right at the stop sign, drive past the front of the Corporate Center and park. For more information, please contact Mike Royer at Michael_Royer@bose.com