Overview:

This course provides an overview of packaging for both Microelectronics and Microsystems (MEMS, sensors, optoelectronics, etc).  Packaging is less glamorous and less studied than device physics, device fabrication, circuit design, and many of the other areas in Microelectronics and Micro.  However, it tends to dominate the cost, size, and performance of devices.  This course will discuss the basics of packaging.  At the end of the course, students should have a good understanding of the fundamentals of packaging, packaging processes, and how to design devices so that they can be packaged.  Because of the diverse student body, topics of interest to students including biomedical packaging, VLSI packaging, and RF packaging will be covered in the last lecture.  Following the 5 lecture sessions, a tour will be given of a local packaging assembly operation.

Detail Outline:

Session 1.  Introduction and electrical aspects of packaging

Session 2.  Mechanical and thermal aspects of packaging, package types, dicing, die attach

Session 3.  Wirebonding, flip chip, multichip modules, packaging reliability and failure mechanisms

Session 4.  Hermetic and non hermetic sealing, wafer bonding, assembly and alignment of Microsystems

Session 5.  Applications of interest to students.  Potential topics include MEMS packaging, RFpackaging, medical device packaging, automotive packaging, lead free packaging.

Session 6.  (tentative) Tour of a packaging operation

Target Audience:

Engineers and students who work in the area of electronics, microelectronics, or microsystems.

Benefits of Attending:

Students will learn how the microelectronics and microsystems are packaged.  This includes the operations involved in packaging and how the package influences the electrical, thermal, and mechanical performance of a device.  The tradeoffs in packaging will be discussed and the student will learn how to design a device so that it can be packaged economically and with a high degree of reliability.  The different aspects of packaging that are important for MEMS and microsystems will also be discussed.

Speaker Bio:

Andrew “Andy” Oliver is employed as a MEMS packaging engineer at Ion Optics in Waltham, MA.  Prior to joining Ion Optics, he was a principal member of the technical staff in the packaging group at Sandia National Laboratories.  This course is based on a three credit course on packaging that he developed and taught at the University of New Mexico.

Decision (Run/Cancel) Date for  this Courses is Friday, March 23, 2007

Course Fee Schedule:

On-line Registration and Payment

On-line registration is closed for this course, but registration is still available on-site between 6:00PM – 6:30PM April 2, 2007 at the Holiday Inn Select, 15 Middlesex Canal Park, Woburn or by contacting the office at 781-245-5405.

Copyright © 2008 IEEE Boston Section. All rights reserved.
Maintained by R M Stelting

Updated Thursday August 16, 2007