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DfR-DESIGN for RINSE-ABILITY: EFFECT OF SMT COMPONENT PACKAGE DESIGN ON CLEANING EFFECTIVENESS 5:30 pm
DfR-DESIGN for RINSE-ABILITY: EFFECT OF SMT COMPONENT PACKAGE DESIGN ON CLEANING EFFECTIVENESS @ Hampton Inn Bedford-Burlington
Apr 10 @ 5:30 pm – 7:30 pm
DfR-DESIGN for RINSE-ABILITY: EFFECT OF SMT COMPONENT PACKAGE DESIGN ON CLEANING EFFECTIVENESS @ Hampton Inn Bedford-Burlington
Reliability Society NORMAN ARMENDARIZ, PHD, ENGR FELLOW, RAYTHEON, ANDOVER, MA PRESENTATION: Recent CCAs-circuit card assemblies manufactured using SMT-surface mount technology processes have exhibited cleaning residues remaining on the surface of components and within electronic component / package housings with discoloration (degradation) of Cu-wire insulation and discoloration (oxidation) of the metal …
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