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“2D & 3D Printing; Changing Form Factors in Microwave Electronics” 5:30 pm
“2D & 3D Printing; Changing Form Factors in Microwave Electronics” @ MIT Lincoln Laboratory
Dec 11 @ 5:30 pm – 7:30 pm
“2D & 3D Printing; Changing Form Factors in Microwave Electronics” @ MIT Lincoln Laboratory
Reliability Society Dr. Craig Armiento Applications such as the Internet of Things (IoT), flexible radars and 5G telecommunications will require new electronic form factors in the microwave and millimeter frequency domains. These applications may require electronics that are flexible, conformable, wearable or embedded in 3D objects. Printed electronics (PE) is …
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